Micron-Level Precision
Advanced manufacturing solutions for semiconductor test equipment, EMI/RFI shielding, and thermal management systems. with .
Precision-Grade Materials for Critical Applications
Specialized material selection and processing for semiconductor test equipment, thermal management, and precision instrumentation.
Explore All MaterialsAluminum 6061/7075
T651 pre-stretched aluminum for dimensional stability in vacuum chambers and test fixtures.
Pure Copper C1100
High-purity copper for maximum thermal conductivity in power semiconductor cooling.
Brass/Bronze Alloys
Precision alloys for probe contacts, connectors, and wear-resistant components.
Semiconductor-Grade Manufacturing Capabilities
Advanced precision manufacturing for the most demanding semiconductor applications, from micro-drilling to ultra-clean surface finishing.
Micron-Level Precision
5-axis CNC machining with ±0.005mm tolerance control. Specialized in thin-wall structures and complex geometries for test fixtures.
Stress Relief Processing
Advanced heat treatment and stress relief processes to maintain dimensional stability over time and temperature cycling.
Micro-machined test probe array
Electromagnetic Shielding & Thermal Management
Specialized enclosures and thermal solutions for high-frequency applications and power semiconductor cooling.
Shielding Enclosures
Deep cavity, thin-wall aluminum structures for RF isolation
Thermal Spreaders
High-conductivity copper bases for power module cooling
Heat Sink Design
Optimized fin geometry for maximum heat dissipation
Surface Treatment
Conductive anodizing for enhanced EMI performance
Performance Specifications
Industry-leading specifications for critical applications
EMI Shielding
-80dB @ 1GHz
Verified performance
Surface Finish
Ra 0.8
Precision machining
Thermal Conductivity
391 W/m·K
Copper base material
Semiconductor-Grade Cleanliness Control
Ultra-clean processing and packaging for contamination-sensitive semiconductor applications.
Ultrasonic Cleaning
Multi-stage ultrasonic cleaning with deionized water and specialized solvents to remove all machining residues.
✓ Class 10K cleanroom environment
✓ Particle size monitoring
Surface Treatment
Controlled anodizing and surface finishing processes that eliminate particle generation and contamination.
✓ Particle-free surface
✓ Outgassing control
Vacuum Packaging
Cleanroom packaging with anti-static materials and vacuum sealing to maintain cleanliness during transport.
✓ Vacuum sealed protection
✓ Contamination certificates
Advanced Quality Control
Comprehensive inspection and testing protocols ensure every component meets semiconductor industry standards.
Coordinate Measuring Machine (CMM)
Three-dimensional precision measurement with ±0.002mm accuracy for critical dimensions and geometric tolerances.
X-Ray Fluorescence (XRF) Spectrometer
Material composition verification and trace element analysis for alloy certification and RoHS compliance.
Surface Roughness Testing
Profilometer measurement of surface finish quality, ensuring Ra 0.4-0.8 specifications for critical surfaces.
Cleanliness Verification
Particle count analysis and contamination testing to verify cleanroom standards and packaging integrity.
Quality Metrics
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Get in Touch
Phone
+86 0769 81886021 / +86 0769 81886025
+86 15625895257 / +86 18128535118
sales@ycsmachining.com
ycsmachining@yeah.net
Address
No.127, DeZheng East Road, Chang'an Town
Dongguan City, Guangdong Province, China 523800